ADLINK TECHNOLOGY Industrial Partner

cPCI-3720A/P72 - Adlink cPCI-3720A/P72 CPU Board with Low Power Pentium III 700MHz...

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Part Number:
cPCI-3720A/P72
Model Number:
cPCI-3720A/P72
Make:
ADLINK
Lead Time:
Available
Qty In Stock:
Available

Adlink cPCI-3720A/P72 CPU Board with Low Power Pentium III 700MHz 3U cPCI SBC with active heat-sink, 1-slot width Simple Type: CPU Board

The cPCI-3720 series products comply with PICMG 2.0 Rev. 3.0 specifications for 3U CompactPCI form factor. The cPCI-3720 series products support both front panel I/O and rear panel I/O. It is not necessary to use the rear board if the application requires only front panel I/O wiring. The front board (the CPU module) and the rear board (the rear I/O transition module, RTM) are sold separately.

Download the datasheet (PDF)

For Resellers and High Volume Orders:
Please request a quote to obtain preferred pricing.

Features

  • 1-slot width version available for low power applications
  • Built-in one USB port, one serial port, integrated PS/2 type keyboard and mouse connector
  • Design for Intel Lower Power BGA2 Pentium-III or Celeron
  • Dual 10/100Mb Ethernet port by Intel 82559 controller, single Ethernet version is also available for big quantity OEM project
  • Internal CompactFlash IDE interface
  • Modularize low profile 2.5 inches HDD mechanism for 2-slot version
  • Modularize slim-type FDD mechanism for 3-slot version
  • One 144-pin SO-DIMM socket supports up to 256MB RAM
  • PICMG 2.1 CompactPCI Hot Swap Specification R2.0 Compliant
  • Standard 3U form factor
  • Support Celeron CPU at 700, 400MHz with 128KB on-die L2 cache
  • Support Pentium-III CPU at 850M, 700M Hz with 256KB on-die L2 cache
  • Support remote console via the serial port
  • Supports 7 bus-master PCI devices on CompactPCI bus
  • PICMG 2.0 CompactPCI Specification R3.0 Compliant

Specifications

    General
  • BIOS: Award PnP BIOS with 2Mb (256KB) Flash ROM
  • Chipset: Intel 440MX Chipset (in EIA Roadmap)
  • CPU: Intel BGA2 Low Power Pentium-III with 256KB on-die L2 cache at full-core speed, Intel BGA2 Low Power Low Power Celeron with 128KB on-die L2 cache at full-core speed
  • Dimensions: 100mm x 160mm
  • Front side bus (FSB) frequency: 100MHz
  • Host Memory: One 144-pin SO-DIMM socket, support maximum 256MB un-buffered SDRAM module
  • Humidity: 5% to 95% non-condensed
  • On Board Super I/O: Winbond W83977EF
  • Operating ambient temperature: 0 to 55C
  • Shock: 15G peak-to-peak, 11 ms duration, non-operation
  • Storage temperature: -20 to 80C
  • USB Interface: Two USB ports, USB-A is on front faceplate. USB-B is on the rear I/O

 

Applications

  • None Available

Aliases

  • None Available